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  doc. no : qw0905-la16b/y-s1-pf rev. : a date : 01 - nov. - 2006 led array data sheet la16b/y-s1-pf lead-free parts ligitek electronics co.,ltd. property of ligitek only pb
page 1/5 7.4 2.0 0.5 4.6 6.5 - + 2.54typ 3.1 2.9 5.0 0.5 4.75 0.5 1.5max 4.3 3.3 0.5 typ 2.54typ 1.0min 25.0min + - ly2640-1-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions part no. la16b/y-s1-pf 5.08 0.5 typ 3.5 ligitek electronics co.,ltd. property of ligitek only
unit ma ma y 20 80 ratings i f parameter peak forward current duty 1/10@10khz forward current symbol i fp absolute maximum ratings at ta=25 mw a 60 10 -40 ~ +85 -40 ~ +100 ir operating temperature storage temperature reverse current @5v power dissipation t opr tstg pd 50 12 8.0 2.6 max. min. typ. 35 585 min. 1.7 forward voltage @20ma(v) peak wave length pnm spectral halfwidth nm viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) gaasp/gap emitted yellow la16b/y-s1-pf part no material typical electrical & optical characteristics (ta=25 ) color lens yellow diffused note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. ligitek electronics co.,ltd. property of ligitek only page 2/5 part no. la16b/y-s1-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip page3/5 part no. la16b/y-s1-pf
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 4/5 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 5 /sec max 260 c3sec max 150 100 time(sec) temp( c) 260 50 preheat 2 /sec max 120 0 0 25 60 seconds max ligitek electronics co.,ltd. property of ligitek only part no. la16b/y-s1-pf
ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description 1.t.sol=230 5 2.dwell time=5 1sec solderability test high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test thermal shock test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature high humidity test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test test itemtest condition reliability test: mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-883:1008 jis c 7021: b-10 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard page 5/5 part no. la16b/y-s1-pf


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